对应环境负荷物质
对RoHS指令限制物质的应对措施
TYPE | Aluminum Electrolytic Capacitors | Film Capacitors | ||||
---|---|---|---|---|---|---|
Chip | Radial Lead | Snap-in | Screw terminal | Metallized | Foil | |
RoHS Compliance | Complied | |||||
Lead | Not contain | |||||
Terminal material | (∼Φ10) Fe/Cu/Sn-0.5Bi |
Fe/Cu/Sn | Aluminum | Fe/Cu/Sn or Cu/Sn |
Fe/Cu/Sn | |
(Φ12.5∼) Fe/Cu/Sn |
||||||
Resistance to Soldering heat | Reflow(*2) | 260℃ Flow Soldering | Not applicable | Please find “Soldering Operation” | ||
Cadmium | Not contain | |||||
Mercury | Not contain | |||||
Chrome(VI) | Not contain(*1) | |||||
PBB/PBDE | Not contain | |||||
DEHP/BBP/DBP/DIBP | Not contain | |||||
Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton lable |
*1:Band of Screw terminal type: Chromium(III)
*2:Please find “Reflow Soldering Condition”.
TYPE | Conductive Polymer Aluminum Solid Electrolytic Capacitors | Polymer Multi-Layer Capacitors | Electric Double Layer Capacitors | |||
---|---|---|---|---|---|---|
PZ-CAP | Chip | Radial Lead | Radial Lead | |||
RoHS Compliance | Complied | |||||
Lead | Not contain | |||||
Terminal material | Lead | Fe/Cu/Sn | Brass/Cu/Sn | Fe/Cu/Sn | Fe/Cu/Sn | |
Chip | Fe/Cu/Sn-0.5Bi | |||||
Resistance to Soldering heat | Lead | Flow Soldering 260℃ |
260℃ Reflow/Flow Soldering |
Flow Soldering 260℃ |
Flow Soldering 260℃ |
|
Chip | Reflow(*2) | |||||
Cadmium | Not contain | |||||
Mercury | Not contain | |||||
Chrome(VI) | Not contain(*1) | |||||
PBB/PBDE | Not contain | |||||
DEHP/BBP/DBP/DIBP | Not contain | |||||
Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton label |
*1:Band of Screw terminal type: Chromium(III)
*2:Please find “Reflow Soldering Condition”.
遵守欧洲REACH法规
根据RIP 3.8TGD(技术指导文件:2008年5月26日发布)的内容,我们的电子元件属于 “无故意释放的物品”,不属于欧洲REACH法规第7.1条 “注册 “的范围。